5G AiP | Antenna-in-Package | Phased Array | For 5G NR | LEO Satellite TMYTEK

Built for 5G. Built for LEO.

AiP technology

AiP is needed for mmWave

Reduce path loss

In 5G mmWave RF module, the antenna must be close to the beamforming circuit as much as possible to reduce the path losses. Antenna-in-Package (AiP) technology turns into an elegant solution.

Size and cost

5G NR mmWave base station and small cell cares about the dimension and the size of the device. AiP provides very compact form factor to be acted as an RU in gNB.

Antenna to ORAN

TMYTEK offers 3 types of packagings that fulfill your needs in developing products.

Antenna and beamformer

TMYTEK is capable of various types of antenna to work with beamformer chips in 28/39/60/77 GHz bands. Antenna BW, gain, steering coverage and polarizations are well modeled to make sure EIRP and other indexes meet the customers.

Up & down conversion

To realize mosaic structure to form a large array by repeating unit AiP module, integrate IF from/to RF circuits into the package is critical to have I/O pin work in IF. A mixer and BPF needed to be integrated into the package, too.

Low PHY

ORAN opens up the opportunities for the base station ecosystem. The new split 7.2 relieves the load of the front haul network. We need the integration of Low PHY in the RU module. We build sophisticated AiP modules for the future.

AiP design consideration

AiP design consideration
antenna

patch or slot
meet FR2 bands
ain, beamwidth

transition

material
simulation
layout

feed

size
complexity
performance

chipset

beamformer
mixer
controller

filter

size vs perf
repeatability
stability

thermal

modeling
flow design
power capacity

Applications of AiP

5G NR

AiP Technology is essential for all 5G mmWave smartphones, base station, and CPEs. For base station, each macro/small cell will use 12/4 mmWave AiP unit modules.

LEO

Spectrums cover Ka/K/Ku bands in mmWave bands. AiP technology is also necessary in satellite and ground terminals

LTCC. 26 layers

TMYTEK worked with Japanese Low Temperature Cofired Ceramic (LTCC) technology company to realize a 4x4 unit AiP module. A 26 layers design integrates 4x4 slot antenna elements and 4 of beamforming chips. A mixer and a multiplier chips are also included to build an IF-ready module.

TMYTEK 4x4 unit AiP module with LTCC. 26 layers.

PCB. 8x8. IF-ready.

8x8 PCB based AiP with mixer and doubler. RF complies with 5G n261 band, IF is 3-5 GHz. 12 layers of PCB with customizable thickness of each layer for performance optimization. A larger array can be formed by repeating multiple unit modules .

TMYTEK AiP module by PCB. 8x8. IF-ready.
TMYTEK AiP module by PCB. 8x8. IF-ready.
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